We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Die Casting Molds.
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Die Casting Molds Product List and Ranking from 44 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Die Casting Molds Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 武生特殊鋼材 Fukui//Manufacturing and processing contract
  2. ザワード Tokyo//Trading company/Wholesale
  3. 東芝ホームテクノ Niigata//Consumer Electronics
  4. 4 WELCON 本社 Niigata//Manufacturing and processing contract
  5. 5 トライエンジニアリング 本社・テクノヒル工場 Aichi//robot
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Die Casting Molds Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Vapor chamber ザワード
  2. Stainless knife steel "CoSP (Cobalt Special)" 武生特殊鋼材
  3. [Information] New Technology of SHP (Slim Vapor Chamber) 東芝ホームテクノ
  4. 4 Stainless knife steel "VG5" 武生特殊鋼材
  5. 5 Friction Stir Welding Device "Robot FSW" トライエンジニアリング 本社・テクノヒル工場

Die Casting Molds Product List

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Special metal composite processing technology *Case studies and catalog available.

Special metal composite processing technology *Case studies and catalog available.

Introducing a collection of case studies on special metal contract processing that can withstand harsh environments and processes, including difficult-to-cut materials machining, electron beam welding, surface treatment, and applications in space and semiconductors!

Our company handles not only general metals such as SUS and aluminum but also a wide range of difficult-to-machine materials, including alloys and high melting point metals. We have extensive experience with various special metals such as titanium, molybdenum, Inconel, tantalum, pure nickel, and cemented carbide. In addition to cutting processing, we can manage various technologies in a one-stop manner, including: - Hardening, annealing, and various heat treatments - Surface treatments such as plating and coating - Electrical discharge machining - Dissimilar material welding and strong welding using electron beams By utilizing composite technologies, we are capable of producing robust machined products. The machined products created using composite technologies are inspected at each stage by various inspection devices, ensuring we meet stringent precision requirements. We handle ultra-high precision machining in micrometer units for coaxiality, perpendicularity, roundness, flatness, parallelism, positional accuracy, and surface roughness. We undertake special metal contract processing that can withstand harsh conditions related to space, semiconductor manufacturing processes, molding processes, firing processes, and corrosive environments. *For more details, please download the PDF or feel free to contact us.

  • alloy
  • Special Steel
  • Rare metals

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Room Temperature Wafer Bonding Device BOND MEISTER【Semiconductor Manufacturing】

Room Temperature Wafer Bonding Device BOND MEISTER【Semiconductor Manufacturing】

A room temperature wafer bonding device that opens new horizons in the bonding process. Supporting device development with high reliability, bonding quality, and bonding support services!

Joining is performed by activating the surface of the joining materials with an ion beam in a vacuum. ■Application in MEMS wafer-level packaging - Packaging can be done at the wafer level before dicing, simplifying subsequent processes. - Since no heating is involved, thermal distortion is eliminated even for fine structures. - Increased productivity as there is no need for heating and cooling time. - Ideal for the development of stacked high-integration MEMS. ■Application to other high-functionality devices - Capable of joining a wide range of materials such as metals, quartz, sapphire, and oxide single crystals. - High yield is achievable due to the absence of thermal distortion. - Dissimilar materials can also be joined at room temperature, enabling previously impossible joints and enhancing design flexibility for devices. A lineup of equipment that maximizes the benefits of the room temperature joining process (all-in-one setup including alignment equipment, wafer transport robots, and bonding mechanisms). For more details, please contact us or download the 'catalog' for confirmation.

  • others

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Heat spreader low thermal expansion high thermal conductivity material "WEL-Therm"

Heat spreader low thermal expansion high thermal conductivity material "WEL-Therm"

Low price due to the absence of rare metals like Mo and W! High toughness ensured by being fully metallic.

"WEL-Therm" is a patented heat spreader made of all-metal construction, ensuring high toughness with low thermal expansion and high thermal conductivity materials. It can be applied in "semiconductor power devices," as well as "power modules such as IGBTs" and "semiconductor manufacturing equipment." It is low-cost because it does not use rare metals like Mo or W. 【Features】 ■ Patented ■ High thermal conductivity: 280W/mK ■ Coefficient of thermal expansion: 5–10ppm/K ■ High toughness ensured due to all-metal construction ■ All design parameters such as thermal conduction core diameter, arrangement density, and total thickness are freely customizable *For more details, please refer to the PDF document or feel free to contact us.

  • Composite Materials

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WEL-Cool Heat Exchanger CF0.5

WEL-Cool Heat Exchanger CF0.5

Cleared the 1 million cycle pressure test under design pressure! Diffusion bonding of base material strength.

The "WEL-Cool Heat Exchanger CF0.5" is a customizable small microchannel heat exchanger with adjustable heat exchange capacity and design pressure. It features high heat exchange performance with φ0.5mm channels and has passed a pressure resistance test of one million cycles at the design pressure. Made entirely of SUS316L, it is lightweight and palm-sized, allowing for direct connection to piping. 【Features】 ■ High heat exchange performance with φ0.5mm channels ■ Lightweight and palm-sized for direct connection to piping ■ Made entirely of SUS316L, with diffusion bonding of base material strength ■ Passed a pressure resistance test of one million cycles at the design pressure ■ Customizable heat exchange capacity and design pressure *For more details, please refer to the PDF document or feel free to contact us.

  • Other environmental equipment
  • Heat exchanger

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WEL-Cool Heat Exchanger PF0.5

WEL-Cool Heat Exchanger PF0.5

High-temperature efficiency counterflow type! Customization of heat exchange amount and design pressure is possible.

The "WEL-Cool Heat Exchanger PF0.5" is a compact microchannel heat exchanger with high heat exchange performance due to its φ0.5mm channels. It is made entirely of SUS316L, with diffusion bonding for base material strength. Customization of heat exchange capacity and design pressure is possible. Additionally, this product features a highly efficient counterflow design. 【Features】 ■ High heat exchange performance with φ0.5mm channels ■ Highly efficient counterflow design ■ Made entirely of SUS316L, with diffusion bonding for base material strength ■ Customization of heat exchange capacity and design pressure *For more details, please refer to the PDF document or feel free to contact us.

  • Other environmental equipment
  • Heat exchanger

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[Must-see for Design Developers] 'Heat Management Device' Utilizing Microchannels

[Must-see for Design Developers] 'Heat Management Device' Utilizing Microchannels

Are you having trouble with heat management for your equipment? There are many applications, including energy, electronic devices, and medical and testing equipment! Let us introduce the heat management devices we offer.

WELCON Co., Ltd. specializes in the production of "thermal management devices." The development of microchannel products using diffusion bonding technology has achieved "high efficiency" and "miniaturization" in thermal management devices. These can be utilized in energy-related equipment, electronic devices, medical devices, and inspection equipment. If you are struggling with thermal management for your equipment, please feel free to consult us. Additionally, you can view materials that not only introduce the thermal management devices we handle but also provide information about microchannels through the "PDF Download." We encourage you to take a look. 【Contents of the materials】 ■ What is a microchannel? ■ Introduction to microchannel thermal management devices ・ Microchannel heat exchangers ・ Microchannel heat sinks (water-cooled) ・ Vapor chambers (VC) *For more details, please refer to the PDF materials or feel free to contact us.

  • Heat exchanger
  • Other electronic parts
  • air conditioning

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Explanation material "What is a Vapor Chamber?" *Free gift

Explanation material "What is a Vapor Chamber?" *Free gift

We are currently offering a free document that clearly explains the features and usage of the heat dissipation device "vapor chamber," which can efficiently spread heat.

We are offering a clear explanatory document that introduces the "vapor chamber," which is suitable for cooling and heat dissipation in electronic devices, industrial equipment, and medical/testing equipment! A vapor chamber is a heat dissipation device that transports and spreads heat, allowing for efficient heat dissipation from various products. Due to its thin sheet form, it has recently been adopted in mobile devices compatible with 5G. This document provides an easy-to-understand explanation of the basics and features of vapor chambers! It includes diagrams and photos, making it accessible even for those who are unfamiliar with vapor chambers. You can download the document immediately from the "PDF Download" link. We encourage you to take a look! [Contents] - What is a vapor chamber? (3 pages total) - Features of vapor chambers (4 pages total)

  • Heat exchanger
  • Other electronic parts
  • air conditioning

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[Explanatory Material] What is a Water-Cooled Microchannel Heat Sink? *Free Distribution

[Explanatory Material] What is a Water-Cooled Microchannel Heat Sink? *Free Distribution

Fresh refrigerant spreads evenly within the plane! It is possible to reduce temperature unevenness, improve cooling efficiency, and achieve low thermal resistance.

A heat sink is a component used to cool absorbed heat, commonly used when dissipating heat from heat sources such as CPUs. Many designs utilize a structure called "fins" to release heat into the air or to flow water internally to absorb heat. Our company designs, manufactures, and sells water-cooled heat sinks, which we refer to as "microchannel heat sinks." The "water-cooled microchannel heat sink" allows fresh coolant to evenly distribute across the surface, reducing temperature variations, improving cooling efficiency, and achieving low thermal resistance. 【Structure】 ■ Matrix structure ■ Distribution flow path ■ Microchannel flow paths arranged across the entire cooling surface ■ Internal structure that evenly distributes coolant to all flow paths *For more details, please refer to the PDF materials or feel free to contact us.

  • Other environmental equipment
  • Heat exchanger

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A must-see for design and development personnel! The potential of diffusion bonding *Achievement list giveaway

A must-see for design and development personnel! The potential of diffusion bonding *Achievement list giveaway

A must-see for design and development personnel! The range of feasible manufacturing methods and functions will expand!

Our company engages in manufacturing using both design technologies for heat, fluid, and structures, as well as diffusion bonding technology. "Diffusion bonding" is a technique that promotes the movement of atoms at the bonding interface by heating and applying pressure to the materials to be joined. This document provides a detailed explanation of the characteristics and processing examples of diffusion bonding through photos and diagrams. If you are interested in diffusion bonding, please feel free to contact us. [Contents] ■ Characteristics of diffusion bonding ■ Processing examples of diffusion bonding *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

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[Free Comprehensive Material Giveaway] Introduction of Compact and High-Performance Thermal Management Components

[Free Comprehensive Material Giveaway] Introduction of Compact and High-Performance Thermal Management Components

Achieving high-performance thermal management components with fine, complex structures!

We can assist customers with challenges in areas such as heat exchange, heating, cooling, temperature uniformity, heat transport, and heat diffusion, from problem extraction and proposal planning to design, analysis, prototyping, performance evaluation, quality assurance, and mass production. We provide high-performance thermal management components that leverage microchannel structures (channels less than 1000μm). Our manufacturing process using "diffusion bonding technology" allows for strong and leak-free joints without melting the metal. We guarantee pressure resistance upon shipment (with achievements in compliance with the High-Pressure Gas Safety Act (KHK), the European Pressure Equipment Directive (PED), and ASME). We will comprehensively introduce our strengths and product lineup. 【Standard Lineup of Thermal Management Components】 ■ Microchannel heat exchangers: Heat transfer (exchange) between fluids ■ Microchannel heat sinks: Heat removal and addition by fluids ■ Vapor chambers: Heat diffusion and transport (sheet-type heat pipes) ■ Inline heaters: Heating and vaporization of fluids *For more details, please download the PDF or feel free to contact us.

  • Heat exchanger

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Kyosei Mold Manufacturing Co., Ltd. Business Introduction

Kyosei Mold Manufacturing Co., Ltd. Business Introduction

Over 250 types of molds produced annually! We create molds that delight our customers.

Kyosei Mold Manufacturing Co., Ltd. is a company primarily engaged in the design and production of die-casting molds. With a well-rounded staff of 20 members specializing in design, modeling, and CAM, we achieve exceptional production speed and continuously implement just-in-time equipment planning to create molds that meet the needs of the times. The maximum mold size we can produce is up to 2,500 tons, but our specialty lies in molds ranging from 90 tons to 800 tons. Please feel free to consult us about high-difficulty molds. [Business Activities] ■ Design and production of die-casting molds *For more details, please refer to our catalog or feel free to contact us.*

  • Mold
  • Other contract manufacturing
  • Machine elements

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[Case Study Presentation] CAM Joining Enabled Dissimilar Material Bonding with Low Thermal Resistance

[Case Study Presentation] CAM Joining Enabled Dissimilar Material Bonding with Low Thermal Resistance

The bonding strength is secured at over 10 MPa in shear tension! It is possible to join dissimilar materials such as metals, resins, and ceramics, which is essential for improving heat dissipation characteristics.

Our company conducts trial processing, specialized CAM agents, and process development using CAM bonding technology. This bonding technology combines chemical bonding and fusion. It is environmentally friendly, allows for easy construction, and can reduce costs. CAM agents are applied and dried on metal surfaces to form an organic film, which bonds the joined materials through thermal pressing. You can read technical documents that describe detailed features and functions. 【Examples of bondable materials】 ■ Metals: Aluminum, Copper, Steel, Titanium ■ Resins: Nylon, PBT, CFRP ■ Ceramics: Alumina, Glass ■ Zero thermal resistance is also possible.

  • Processing Contract

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Prototype molds, simple molds, small lot die casting.

Prototype molds, simple molds, small lot die casting.

It is possible to provide with short delivery times and low costs. There have been achievements where the delivery time was shortened to about two-thirds and the cost was reduced to about half!

Trial molds, simple molds, and small lot die casting refer to manufacturing methods suitable for producing prototypes and mass production in quantities of about 50 to 100 using die casting. Our company achieves short delivery times and low costs through our unique "MC Process." We carefully create a beautiful casting surface and finish small lots with the same precision as mass production processes. For example, a product that typically takes about 35 days and costs around 1 million yen to produce using standard die casting can be reduced to about two-thirds of the time and approximately half the cost using our unique process. Please feel free to contact us when you need our services. 【Reasons for Short Delivery Times】 - Direct processing through the transition from CAD to CAM - Smooth CAD conversion due to high casting technology and know-how - Smooth information exchange of CAD facilitates mutual understanding with customers - Although electrical discharge machining is commonly used in mold manufacturing, we eliminate electrode production and electrical discharge machining, processing everything directly with MC. *For more details, please refer to the related links or feel free to contact us.

  • mould_img13.jpg
  • mould_img14.jpg
  • mould_img15.jpg
  • mould_img16.jpg
  • Mold Design
  • Other molds
  • Prototype Services

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Processing-free case: "Serial printer parts"

Processing-free case: "Serial printer parts"

Support for one-touch mechanism due to processing-free head and carriage engagement.

We have achieved processing without machining in "aluminum die casting," which was said to be difficult due to high-temperature casting, and we have received high praise from everyone. Our feature is the one-touch mechanism that accommodates processing-free connections between the head and carriage. 【Features】 ○ Manufacturing experience: 22 years ○ Production quantity: Approximately 15,000,000 sets For more details, please contact us or download the catalog.

  • Contract manufacturing

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